Mechanical simultaneous registration of multi-pin surface-mount

Details Mechanical simultaneous registration of multi-pin surface-mount Mechanical simultaneous registration of multi-pin surface-mount

1989-12-11

1991-07-23

Hille, Rolf

Electricity: electrical systems and devices

Safety and protection of systems and devices

With specific current responsive fault sensor

357 80, 361400, 269903, 29832, 29834, H01L 2302, H01L 2312

Patent

active

050348027

ABSTRACT:
A method and structure are provided for aligning SMDs to a substrate. The body of an SMD and that portion of a substrate encircled by the electrical interconnect pads each have a mating physical structure such that the SMD may be quickly placed in the general vicinity of its proper location and the mating physical features cause a precise alignment. In one embodiment, the physical features are nonsymmetrical, thereby preventing accidental placement of the SMD in an undesired rotation. In another embodiment, the physical features vary among device types, thereby ensuring that an improper device is not placed in a particular location on the substrate. In another embodiment, a component carrier is provided which includes depressions for the placement of the SMDs. A vacuum is applied to the carrier which holds each of the SMDs in place. The carrier is then placed in a desired physical relationship with the substrate such that each of the devices held in the carrier is properly aligned with the substrate. In another embodiment, a standard substrate is used without the requirement of physical mating features. Those physical mating features are provided by the use of a grid structure which is placed with proper registration on the substrate such that the physical pattern of the grid ensures proper placement of components with respect to the pads on the substrate.

REFERENCES:
patent: 3521128 (1970-07-01), Oates
patent: 3695502 (1972-10-01), Gaiser
patent: 3930295 (1976-01-01), Rose
patent: 4528747 (1985-07-01), Hoffman et al.
patent: 4670770 (1987-06-01), Tai
patent: 4670981 (1987-06-01), Kubota et al.
patent: 4733462 (1988-03-01), Kawatani
patent: 4883300 (1989-11-01), Akagawa
"How to Use Surface Mount Technology", Jerry Mullen, Texas Instruments Corp., (1984): and Solderability: A Key to Successful Surface Mount Assembly, Richard S. Murphy (1988) Printed Circuit Assembly, pp. 20-23.

Affiliated with

Also associated with

Rating

Mechanical simultaneous registration of multi-pin surface-mount does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Mechanical simultaneous registration of multi-pin surface-mount , we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Mechanical simultaneous registration of multi-pin surface-mount will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-436556