Mechanical lift-off process of a metal layer on a polymer

Details Mechanical lift-off process of a metal layer on a polymer Mechanical lift-off process of a metal layer on a polymer

1992-09-14

1993-08-10

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156630, 156634, 156655, 156656, 1566591, 156668, 156902, H01L 21306, B44C 122, C23F 100, B29C 3700

Patent

active

052345394

ABSTRACT:
A lift-off process for removing a portion of a metal layer (4). The metal layer is formed on a dielectric polymer substrate with interposition of a corresponding portion of an intermediate layer (2). This process comprises the steps of selecting the material of the intermediate layer so that its interface with the metal has a low adhesivity; applying to the structure a mechanical stress causing detachment of the metal at the interface; and chemically removing the intermediate layer.

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Patent Abstracts of Japan, vol. 8, No. 228, Yokota, 1984 JP-A-59-107354(a).

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