Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Reexamination Certificate
2007-12-27
2010-11-09
Clark, S. V (Department: 2823)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
For plural devices
C257S723000
Reexamination Certificate
active
07830003
ABSTRACT:
A device according to the present invention includes a MEMS device supported on a first side of a die. A first side of an isolator is attached to the first side of the die. A package is attached to the first side of the isolator, with at least one electrically conductive attachment device attaching the die to the isolator and attaching the isolator to the package. The isolator may include isolation structures and a receptacle.
REFERENCES:
patent: 6768196 (2004-07-01), Harney et al.
patent: 6946742 (2005-09-01), Karpman
patent: 7166911 (2007-01-01), Karpman et al.
patent: 2004/0041254 (2004-03-01), Long et al.
patent: 2005/0189635 (2005-09-01), Humpston et al.
patent: 2007/0170525 (2007-07-01), Eskridge
patent: 2009/0282915 (2009-11-01), Ohta et al.
Eskridge Mark
Foster Michael
Jafri Ijaz
Zhou Shifang
Black Lowe & Graham PLLC
Born P. G. Scott
Clark S. V
Honeywell International , Inc.
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