Mechanical enhancement of dense and porous organosilicate...

Details Mechanical enhancement of dense and porous organosilicate... Mechanical enhancement of dense and porous organosilicate...

2003-07-21

2008-12-23

Whitehead, Jr., Carl (Department: 2813)

Semiconductor device manufacturing: process

Having organic semiconductive component

C438S780000, C438S795000, C427S255280, C427S569000, C501S039000, C501S080000

Reexamination Certificate

active

07468290

ABSTRACT:
Low dielectric materials and films comprising same have been identified for improved performance when used as interlevel dielectrics in integrated circuits as well as methods for making same. In one aspect of the present invention, an organosilicate glass film is exposed to an ultraviolet light source wherein the film after exposure has an at least 10% or greater improvement in its mechanical properties (i.e., material hardness and elastic modulus) compared to the as-deposited film.

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