Coating apparatus – Control means responsive to a randomly occurring sensed... – Temperature responsive
Reexamination Certificate
2004-03-05
2008-12-16
Lamb, Brenda A (Department: 1792)
Coating apparatus
Control means responsive to a randomly occurring sensed...
Temperature responsive
C118S666000, C118S429000
Reexamination Certificate
active
07465358
ABSTRACT:
Embodiments of the invention generally provide a fluid processing chamber, sensors and a controller and method for using the same. The fluid processing chamber includes an inlet region, a processing region and an outlet region. The inlet region generally contains one or more sensors and an external controller to monitor the characteristics of the processing fluid at the inlet to the processing region. The outlet region generally contains one or more sensors and an external controller to monitor the characteristics of the processing fluid leaving the processing region of the chamber. In one embodiment the processing region contains one or more sensors and an external controller to monitor the characteristics of the processing fluid in the processing region. The sensors may include, for example, an ORP probe, a temperature sensor, a conductivity sensor, a dissolved hydrogen sensor, a dissolved oxygen sensor, and a pH sensor. The fluid processing chamber is generally useful for all process steps done to deposit an electroless deposited film on a substrate including, for example, all pre-clean process steps (substrate preparation steps), all electroless activation process steps, all electroless deposition steps, and all post electroless deposition cleaning steps.
REFERENCES:
patent: 3900599 (1975-08-01), Feldstein
patent: 4276323 (1981-06-01), Oka et al.
patent: 4350717 (1982-09-01), Araki et al.
patent: 4684545 (1987-08-01), Fey et al.
patent: 4922277 (1990-05-01), Carlson et al.
patent: 4998068 (1991-03-01), McKee, Jr.
patent: 5172332 (1992-12-01), Hungerford et al.
patent: 5368718 (1994-11-01), Conrod et al.
patent: 5798940 (1998-08-01), Bratton et al.
patent: 6488984 (2002-12-01), Wada et al.
patent: 6632335 (2003-10-01), Kunisawa et al.
patent: 2004/0065540 (2004-04-01), Mayer et al.
patent: 2004/0137161 (2004-07-01), Segawa et al.
patent: 2004/0154535 (2004-08-01), Chen et al.
patent: 1 496 542 (2005-01-01), None
patent: WO 02/083981 (2002-10-01), None
patent: WO 03/014416 (2003-02-01), None
patent: WO 2005/036615 (2005-04-01), None
International Search Report dated Jul. 8, 2005 for corresponding PCT application, PCT/US2004/034456.
Lubomirsky Dmitry
Weidman Timothy W.
Applied Materials Inc.
Lamb Brenda A
Patterson & Sheridan
LandOfFree
Measurement techniques for controlling aspects of a... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Measurement techniques for controlling aspects of a..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Measurement techniques for controlling aspects of a... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4050620