Measurement box with module for measuring wafer characteristics

Details Measurement box with module for measuring wafer characteristics Measurement box with module for measuring wafer characteristics

2005-05-10

2005-05-10

Pham, Hoa Q. (Department: 2877)

Optics: measuring and testing

Inspection of flaws or impurities

C356S237500, C427S008000

Reexamination Certificate

active

06891609

ABSTRACT:
A measurement box which can be integrated into existing wafer processing equipment. The measurement box comprises an enclosure which contains a measurement module for measuring objects such as the surfaces of wafers. The measurement module is equipped with a miniaturized measuring device and has a displaceable measuring head and a plane table with a rotatable wafer holder. The enclosure has at least one loading opening for the wafer to pass through as well as a ventilation device.

REFERENCES:
patent: 5502567 (1996-03-01), Pokrowsky et al.
patent: 5872632 (1999-02-01), Moore
patent: 5897710 (1999-04-01), Sato et al.
patent: 6091499 (2000-07-01), Abraham et al.
patent: 6157450 (2000-12-01), Marchese-Ragona et al.
patent: 05-259259 (1993-10-01), None

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