Means of integrating a microphone in a standard integrated...

Details Means of integrating a microphone in a standard integrated... Means of integrating a microphone in a standard integrated...

2008-01-08

2008-01-08

Ho, Tu-Tu (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

Physical deformation

C257S737000, C257SE31052, C381S175000, C381S174000, C381S191000

Reexamination Certificate

active

07317234

ABSTRACT:
A means of integrating a microphone on the same integrated circuit die as other electronics in the system is disclosed. The structure uses solder bump technology to form a gap between an electrode on the silicon and another electrode. Charge is stored on the capacitor so when pressure from sound waves causes one electrode to flex, the capacitance and therefore the charge changes, causing signal current. The structure allows for area efficiency by allowing placement of active silicon circuitry under the microphone.

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