Means and method for a self-aligned multilayer laser epitaxy str

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step

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156649, 156612, 148175, 29580, 29569L, 357 55, 357 17, 372 46, H01L 2120, H01L 21306, H01S 319

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046234276

ABSTRACT:
A method of forming the proper metallization contacts in a multilayer epitaxy laser device is provided. By selecting the proper crystal plane orientation in etching nonplanar features like channels for the device, a differential etch rate in a free-etch can be effected to remove only selected portions of the top layer and to provide self-alignment in the metallization process.

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Tijburg et al., "Selective Etching of III-V Compounds with Redox System", J. Electrochemic Soc., vol. 123, No. 5, May 1976, pp. 687-691.
Otsubo et al., "Preferential Etching of GaAs through Photoresist Masks", J. Electrochemical Soc., vol. 123, No. 5, May 1976, pp. 676-680.
Shima et al., "Buried Convex Waveguide Structure (GaAl)As Injection Lasers", Appl. Phys. Lett., vol. 38, No. 8, Apr. 1981, pp. 605-607.
Tsang et al., "Profile and Groove-Depth Control in GaAs . . . Etching in H.sub.2 SO.sub.4 -H.sub.2 O.sub.2 -H.sub.2 O System", Applied Physics Letters, vol. 28, No. 1, Jan. 1, 1976, pp. 44-46.
"Physics of Semiconductor Devices", S. M. Sze, Wiley-Interscience, 1969, pp. 452-455 and 470-473.

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