Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1983-08-12
1986-11-18
Kimlin, Edward
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156649, 156612, 148175, 29580, 29569L, 357 55, 357 17, 372 46, H01L 2120, H01L 21306, H01S 319
Patent
active
046234276
ABSTRACT:
A method of forming the proper metallization contacts in a multilayer epitaxy laser device is provided. By selecting the proper crystal plane orientation in etching nonplanar features like channels for the device, a differential etch rate in a free-etch can be effected to remove only selected portions of the top layer and to provide self-alignment in the metallization process.
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patent: 4433417 (1984-02-01), Burnham et al.
patent: 4503539 (1985-03-01), Mori et al.
Lida et al., "Selective Etching of GaAs in H.sub.2 SO.sub.4 -H.sub.2 O.sub.2 -H.sub.2 O System", J. Electrochemical Soc., vol. 118, No. 5, May 1971, pp. 768-771.
Tijburg et al., "Selective Etching of III-V Compounds with Redox System", J. Electrochemic Soc., vol. 123, No. 5, May 1976, pp. 687-691.
Otsubo et al., "Preferential Etching of GaAs through Photoresist Masks", J. Electrochemical Soc., vol. 123, No. 5, May 1976, pp. 676-680.
Shima et al., "Buried Convex Waveguide Structure (GaAl)As Injection Lasers", Appl. Phys. Lett., vol. 38, No. 8, Apr. 1981, pp. 605-607.
Tsang et al., "Profile and Groove-Depth Control in GaAs . . . Etching in H.sub.2 SO.sub.4 -H.sub.2 O.sub.2 -H.sub.2 O System", Applied Physics Letters, vol. 28, No. 1, Jan. 1, 1976, pp. 44-46.
"Physics of Semiconductor Devices", S. M. Sze, Wiley-Interscience, 1969, pp. 452-455 and 470-473.
Ackley Donald E.
Engelmann Reinhart W. H.
Inouye Teruko K.
Hewlett--Packard Company
Hoch Ramon R.
Kimlin Edward
Wong Edward Y.
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