Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1983-11-10
1986-08-12
Bernstein, Hiram H.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
422247, 414222, 414217, 269287, 118726, 118503, C30B 2306
Patent
active
046054693
ABSTRACT:
A molecular beam epitaxy system wherein the molybdenum substrate holder and the molybdenum ring which assembles to the substrate holder to hold the wafer are kept in vacuum essentially all the time. Wafers are not pre-mounted to substrate holders, but the wafer mounting step is performed in ultrahigh vacuum after a cassette of wafers has already been loaded and outgassed, under ultrahigh vacuum. Thus, the substrate holder can be outgassed separately at high temperatures, and can remain under high vacuum.
REFERENCES:
patent: 4137865 (1979-02-01), Cho
patent: 4201152 (1980-05-01), Luscher
patent: 4308756 (1982-01-01), Robinson et al.
patent: 4378189 (1983-03-01), Takeshita et al.
Pamplin, Crystal Growth, Pergamon, pp. 221-231, 1980, second edition.
Bennett Tommy J.
Shih Hung-Dah
Bernstein Hiram H.
Comfort James T.
Groover Robert
Hoel Carlton H.
Texas Instruments Incorporated
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