Active solid-state devices (e.g. – transistors – solid-state diode – Physical configuration of semiconductor – With peripheral feature due to separation of smaller...
Reexamination Certificate
2001-04-05
2008-10-28
Thomas, T. (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Physical configuration of semiconductor
With peripheral feature due to separation of smaller...
C257S690000, C257S692000, C257S784000
Reexamination Certificate
active
07443010
ABSTRACT:
A matrix form semiconductor package substrate that has an electrode situated in-between a plurality of IC package substrates for providing electrical communication to conductive pads on the substrate is provided. The matrix form semiconductor package substrate includes a plurality of IC package substrates that are integrally formed on a strip in a matrix pattern that has a boundary between each two of the plurality of IC package substrates. Each of the plurality of IC package substrates has a multiplicity of conductive pad traces and an electrode, or a plating bar, formed in a serpentine configuration along the boundary for providing electrical communication to the multiplicity of conductive pads.
REFERENCES:
patent: 6121678 (2000-09-01), Chiu et al.
patent: 6319750 (2001-11-01), Huang et al.
patent: 6-204394 (1994-07-01), None
Huang Chender
Tsao Pei-Haw
Wang Chung-Yu
Taiwan Semiconductor Manufacturing Co. Ltd.
Thomas T.
Tung & Associates
Vu Hung Kim
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