Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Radiation sensitive composition or product or process of making
Reexamination Certificate
2011-03-22
2011-03-22
Chu, John S (Department: 1722)
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Radiation sensitive composition or product or process of making
C430S325000, C430S905000, C562S468000, C568S640000, C568S720000
Reexamination Certificate
active
07910284
ABSTRACT:
To overcome the problem that a device performance is degraded by the edge roughness of a photoresist pattern, a mixture of polynuclear phenol compounds having, in one molecule, 0 to 6 functional groups which are chemically converted due to actions of an acid with the solubility in an alkaline developer reduced is used as a material for photoresist. In the mixture, two or more triphenyl methane structures are bonded to portions other than the functional group in the nonconjugated state. Furthermore, the mixture comprises polynuclear compounds with the average number of functional groups of 2.5 or below and includes the polynuclear compounds not having any functional group per molecule by 15% or less in the term of weight ratio, and the polynuclear phenol compounds having 3 or more functional groups per molecule by 40% or less.
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Mitsuru Narithiro, et al.; 10-nm-Scale Pattern Delineation Using Calixarene Electron Beam Resist for Complementary Metal Oxide Semiconductor Gate Etching; Japanese Journal of Applied Physics; 2005; pp. 5581-5585; vol. 44; No. 7B.
Hada Hideo
Kojima Kyoko
Shiono Daiju
Antonelli, Terry Stout & Kraus, LLP.
Chu John S
Hitachi , Ltd.
Tokyo Ohka Kogyo Co. Ltd.
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