Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond
Reexamination Certificate
2006-12-12
2006-12-12
Clark, S. V. (Department: 2823)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Die bond
C257S700000
Reexamination Certificate
active
07148577
ABSTRACT:
Improved materials for use in the fabrication of electronic devices and devices made therewith are described. The materials comprise fillers having a negative coefficient of thermal expansion.
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Discussion within the present Information Disclosure Statement.
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Blakely , Sokoloff, Taylor & Zafman LLP
Clark S. V.
Intel Corporation
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