Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Physical deformation
Reexamination Certificate
2007-08-14
2007-08-14
Pert, Evan (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Responsive to non-electrical signal
Physical deformation
C257S417000, C257S419000, C257S420000, C257S040000, C257S642000, C257S750000, C257S759000
Reexamination Certificate
active
10453933
ABSTRACT:
A micro-electromechanical device is formed on a substrate. The device has sliding, abrading or impacting surfaces. At least one of these surfaces is covered with an anti-stiction material. The anti-stiction material is provided from a slicon compound precursor (e.g. silane, silanol) or multiple silicon compound precursors. Preferably the precursor(s) is fluorinated—more preferably perfluorinated, and is deposited with a solvent as a low molecular weight oligomer or in monomeric form. Examples include silanes (fluorinated or not) with aromatic or polycyclic ring sturctures, and/or silanes (fluorinated or not) having alkenyl, alkynyl, epoxy or acrylate groups. Mixtures either or both of these groups with alkyl chain silanes (preferably fluorinated) are also contemplated.
REFERENCES:
patent: 4736048 (1988-04-01), Brown et al.
patent: 4889753 (1989-12-01), Brown et al.
patent: 5482564 (1996-01-01), Douglas et al.
patent: 5523878 (1996-06-01), Wallace et al.
patent: 6051321 (2000-04-01), Lee et al.
patent: 6365229 (2002-04-01), Robbins
patent: 6508979 (2003-01-01), Requicha et al.
patent: 6674140 (2004-01-01), Martin
patent: 2001/0053016 (2001-12-01), Nelson
patent: 2002/0086101 (2002-07-01), Jacobs
patent: 2003/0161949 (2003-08-01), Ashurst et al.
patent: 2004/0026775 (2004-02-01), Hecht et al.
patent: WO 02/33749 (2002-04-01), None
Dutoit, B.M. et al. “Self-assembled Real Monolayer coating to improve release of MEMS Structures”, Transducers '03, The 12thInternational Conference on Solid State Sensors, Actuators and Microsystems, Boston, Jun. 8-12, 2003, pp. 810-812.
Ashurst, W.R. et al., “Wafer Level Anti-Stiction Coatings with Superior Thermal Stability”, Proceedings of Solid-State Sensor, Actuator and Microsystems Workshop, Hilton Head Island, SC, 2002, pp. 142-145.
Mastrangelo, C.H., “Suppression of stiction in MEMS”, 1999 Fall MRS Meeting, Boston, Nov. 28-Dec. 2, 1999, pp. 1-12.
Srinivason, U. et al. “Alkyltrichlorosilane-Based Self-Assembled Monolayer Films for Stiction Reduction in Silicon Micromachines”, Journal of Microelectromechanical Systems, vol. 7, No. 2, Jun. 1998, pp. 252-260.
Reid Jason S.
Viswanathan Nungavram S.
Erdem Fazli
Kubovcik & Kubovcik
Pert Evan
Silecs Oy
LandOfFree
Materials and methods for forming hybrid organic-inorganic... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Materials and methods for forming hybrid organic-inorganic..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Materials and methods for forming hybrid organic-inorganic... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3848618