Active solid-state devices (e.g. – transistors – solid-state diode – Physical configuration of semiconductor – Groove
Reexamination Certificate
2007-04-03
2007-04-03
Ngô, Ngâen V. (Department: 2818)
Active solid-state devices (e.g., transistors, solid-state diode
Physical configuration of semiconductor
Groove
C257S643000, C257S647000, C257SE21546, C257SE21553, C257SE21585
Reexamination Certificate
active
10908480
ABSTRACT:
Sealing a via using a soventless, low viscosity, high temperature stable polymer or a high solids content polymer solution of low viscosity, where the polymeric material is impregnated within the via at an elevated temperature. A supply chamber is introduced to administer the polymeric material at an elevated temperature, typically at a temperature high enough to liquefy the polymeric material. The polymeric material is introduced through heated supply lines under force from a pump, piston, or a vacuum held within said supply chamber.
REFERENCES:
patent: 5904502 (1999-05-01), Ference
patent: 5998292 (1999-12-01), Black et al.
patent: 6593644 (2003-07-01), Chiu et al.
patent: 6740931 (2004-05-01), Kouzuki et al.
Berger Michael
Buchwalter Leena P.
Canaperi Donald F.
Casey Jon A.
Horton Raymond R.
Blecker Ira D.
Curcio Robert
DeLio & Peterson LLC
International Business Machines - Corporation
Ngô Ngâen V.
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