Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – Insulative material deposited upon semiconductive substrate
Patent
1998-02-12
2000-02-08
Bowers, Charles
Semiconductor device manufacturing: process
Coating of substrate containing semiconductor region or of...
Insulative material deposited upon semiconductive substrate
438780, 438781, 438787, 438790, H01L 2144
Patent
active
060228148
ABSTRACT:
A material of forming silicon oxide film comprising a polymer having a repeating unit represented by the following general formula (1A), (1B) or (1C); ##STR1## wherein R.sup.1 is a substituent group which can be eliminated at a temperature ranging from 250.degree. C. to the glass transition point of the material of forming silicon oxide film; and R.sup.2 is a substituent group which cannot be eliminated at a temperature of 250.degree. C. or more.
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Jeff W. Labadie, et al., Nanopore Foams of High Temperature Polymers, IEEE Transactions on Components, Hybrids and Manufacturing Technology, vol. 15, No. 6, (1992), pp. 925-930.
R.D. Miller, et al.,Polyimide Nanofoams From Amorphous Phase Separated Triblosk Copolymers, A.C.S. Polymer Preprints, vol. 37, No. 1, (1996), pp. 148-149.
J.L. Hedrick, et al., Polyimide Nanofoams From Aliphatic Polyester Based Copolymers, A.C.S. Polymer Preprints, vol. 37, No. 1, (1996), pp. 156-157.
Hayase Shuji
Mikoshiba Satoshi
Nakano Yoshihiko
Bowers Charles
Kabushiki Kaisha Toshiba
Kilday L. A.
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