Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Finishing or perfecting composition or product
Reexamination Certificate
2008-07-15
2008-07-15
Hamilton, Cynthia (Department: 1795)
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Finishing or perfecting composition or product
C430S328000, C430S329000, C430S330000, C430S315000
Reexamination Certificate
active
07399582
ABSTRACT:
In the method wherein a resist pattern is miniaturized effectively by applying a fine pattern forming material, the fine pattern forming material used for providing with a cured coated layer pattern, wherein development defects are reduced by water development is offered, wherein the fine pattern forming material comprises a water-soluble resin, a water-soluble crosslinking agent and water or a mixed solution consisting of water and a water-soluble organic solvent, and further comprises an amine compound.
REFERENCES:
patent: 3615458 (1971-10-01), Dykstra
patent: 3725061 (1973-04-01), Verhille et al.
patent: 5858620 (1999-01-01), Ishibashi et al.
patent: 5968712 (1999-10-01), Thackeray et al.
patent: 6319853 (2001-11-01), Ishibashi et al.
patent: 6555607 (2003-04-01), Kanda et al.
patent: 6902862 (2005-06-01), Takahashi et al.
patent: 7033735 (2006-04-01), Ho et al.
patent: 2002/0037946 (2002-03-01), Isozaki et al.
patent: 2003/0091732 (2003-05-01), Kanda
patent: 2003/0113663 (2003-06-01), Kobayashi
patent: 2003/0194639 (2003-10-01), Miya et al.
patent: 2004/0072098 (2004-04-01), Kozawa et al.
patent: 2004/0121259 (2004-06-01), Kozawa et al.
patent: 2005/0031987 (2005-02-01), Nozaki et al.
patent: 2006/0088788 (2006-04-01), Kudo et al.
patent: 2006/0211814 (2006-09-01), Nishikawa et al.
patent: 2006/0258809 (2006-11-01), Sugeta et al.
patent: 2007/0059644 (2007-03-01), Takahashi et al.
patent: 1 223 470 (2002-07-01), None
patent: 1 223 470 (2002-07-01), None
patent: 1 398 671 (2004-03-01), None
patent: 1398671 (2004-03-01), None
patent: 1 757 989 (2007-02-01), None
patent: 5-241348 (1993-09-01), None
patent: 6-250379 (1994-09-01), None
patent: 9-235318 (1997-09-01), None
patent: 10-73927 (1998-09-01), None
patent: 11-204399 (1999-07-01), None
patent: 2001-109165 (2001-04-01), None
patent: 2002-49161 (2002-02-01), None
patent: 2004-77951 (2004-03-01), None
Duncalf et al “Light-Sensitized Crosslinking of Polyvinyl Alcohol by Chrmium Compounds”, Journal of Applied Polymer Science, col. 8, pp. 1763-1776, year -1964 (no month given).
U.S. Appl. No. 11/660,199, filed Feb. 17, 2007, Kiyohisa et al.
English Language Abstract of JP 5-241348. Copyright Date 2003 No Month Given.
English Language Abstract of JP 6-250379. Copyright Date 2003 No Month Given.
English Language Abstract of JP 9-235318. Copyright Date 2003 No Month Given.
English Language Abstract of 10-73927. Copy Generated May 8, 2006.
English Language Abstract of JP 11-204399. Copyright 2003 No Month.
English Language Abstract of JP 2001-109165. Copyright 2003 No Month.
English Language Abstract of JP 2002-49161. Copyright 2003 No Month.
English Language Abstract of JP 2004-77951. Copy Generated May 8, 2006.
Machine Language English Translation from JPO of JP 5-241346. Generated May 8, 2006.
Machine Language English Translation from JPO of JP 6-250379. Generated May 8, 2006.
Machine Language English Translation from JPO of JP 9-235318. Generated May 8, 2006.
Machine Language English Translation from JPO of JP 10-73927. Generated May 8, 2006.
Machine Language English Translation from JPO of JP 11-204399. Generated May 8, 2006.
Machine Language English Translation from JPO of JP 2001-109165. Generated May 8, 2006.
Machine Language English Translation from JPO of JP 2002-49161. Generated May 8, 2006.
Machine Language English Translation from JPO of JP 2004-77951. Generated May 8, 2006.
Takahashi Kiyohisa
Takano Yusuke
AZ Electronic Materials USA Corp.
Hamilton Cynthia
Jain Sangya
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