Material composition analysis system and method

Details Material composition analysis system and method Material composition analysis system and method

2008-04-15

2008-04-15

Berman, Jack (Department: 2881)

Radiant energy

Inspection of solids or liquids by charged particles

Electron probe type

C250S307000, C250S311000, C250S339030, C250S288000, C378S045000, C378S046000, C378S049000, C378S050000, C378S082000, C378S083000, C378S084000

Reexamination Certificate

active

07358494

ABSTRACT:
The material composition of a thin film formed on a substrate or covered by a cap layer that shares one or more elements with the thin film can be determined by combining characteristic material data, such as characteristic x-ray data, from a material composition analysis tool, such as an electron probe-based x-ray metrology (EPMA) operation, with thickness data and (optionally) possible material phases for the thin film. The thickness data and/or the material phase options can be used to determine, for example, the penetration depth of a probe e-beam of the EPMA tool. Based on the penetration depth and the thin film thickness, the characteristic x-ray data from the EPMA operation can be analyzed to determine the composition (e.g., phase or elemental composition) of the thin film. An EPMA tool can include ellipsometry capabilities for all-in-one thickness and composition determination.

REFERENCES:
patent: 6787773 (2004-09-01), Lee

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