Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Solder wettable contact – lead – or bond
Patent
1997-08-07
2000-11-14
Clark, Sheila V.
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Solder wettable contact, lead, or bond
257780, 257781, H01L 2348, H01L 2352, H01L 2940
Patent
active
061474134
ABSTRACT:
The present invention relates to an improved method for forming a UBM pad and solder bump connection for a flip chip which eliminates at least two mask steps required in standard UBM pad forming processes when repatterning the bond pad locations.
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Clark Sheila V.
Micro)n Technology, Inc.
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