Marking wafers using pigmentation in a mounting tape

Details Marking wafers using pigmentation in a mounting tape Marking wafers using pigmentation in a mounting tape

2006-03-21

2006-03-21

Lebentritt, Michael (Department: 2812)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S107000, C438S108000, C438S110000

Reexamination Certificate

active

07015064

ABSTRACT:
Wafer level techniques for marking the back surfaces of integrated circuit devices are described. A wafer mounting tape is provided that includes releasable pigments. The pigments can be released by exposing the mounting tape to a selected frequency of electromagnetic radiation (e.g., UV light). The released pigments mark the back surface of the wafer. The exposure and pigmentation may be controlled using a variety of techniques including servo control of a light source, the use of masks or reticles or other suitable techniques. The marking may be done on any suitable back surface material including polymeric backcoatings, metalized films or directly on semiconductor materials.

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