Manufacturing tool for wafer level package and method of...

Details Manufacturing tool for wafer level package and method of... Manufacturing tool for wafer level package and method of...

2011-07-26

2011-07-26

Picardat, Kevin M (Department: 2822)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

C438S458000, C438S464000

Reexamination Certificate

active

07985626

ABSTRACT:
A manufacturing method of placing dice for a wafer level package comprises placing a plurality of dice on an elastic material, which is formed on a first base, and the elastic material of the present invention has viscosity in a first condition to adhere the plurality of dice; forming an adhesive material on a second base; adhering the plurality of dice on the adhesive material of the second base; and stripping the plurality of dice from the elastic material in a second condition.

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