Manufacturing process of emboss type flexible or rigid...

Details Manufacturing process of emboss type flexible or rigid... Manufacturing process of emboss type flexible or rigid...

2007-11-20

2007-11-20

Tran, Binh X. (Department: 1765)

Etching a substrate: processes

Forming or treating electrical conductor article

C216S017000, C216S018000, C216S020000, C216S078000

Reexamination Certificate

active

11197332

ABSTRACT:
A manufacturing process of an emboss type flexible or rigid printed circuit board includes multiple steps. First, a layer of dry film is applied to a layer of copper foil. Then a circuit pattern is formed on the copper foil through photolithography processes. An etching stop layer is electroplated on the circuit pattern. The etching stop layer is then electroplated with copper. The copper foil is softened by a high temperature process after removing the dry film. Then the layer of the copper foil is etched after coating with an organic surface layer and the organic surface layer is solidified.

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patent: 2002/0081530 (2002-06-01), Yamamoto et al.
patent: 2004/0124533 (2004-07-01), Keser et al.

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