Manufacturing process and structure of power junction field...

Semiconductor device manufacturing: process – Formation of semiconductive active region on any substrate – Amorphous semiconductor

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257SE21008, C257S421000

Reexamination Certificate

active

11194354

ABSTRACT:
A manufacturing process and a power junction field-effect transistor (JFET) are provided. The basic concept of the present invention is to allow the current to flow vertically from the drain region on the bottom side to the source region on the topside of the device. By regulating the voltage applied between the gate regions and the source region, the power junction field-effect transistor (JFET) of the present invention can be built to handle large current and higher voltage for power management purposes, as is similar to the metal oxide semiconductor field effect transistor (MOSFET).

REFERENCES:
patent: 6326317 (2001-12-01), Wang et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Manufacturing process and structure of power junction field... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Manufacturing process and structure of power junction field..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Manufacturing process and structure of power junction field... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3747462

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.