Manufacturing method of semiconductor integrated circuit device

Details Manufacturing method of semiconductor integrated circuit device Manufacturing method of semiconductor integrated circuit device

2006-06-21

2008-08-05

Lebentritt, Michael S. (Department: 2812)

Semiconductor device manufacturing: process

With measuring or testing

Electrical characteristic sensed

Reexamination Certificate

active

07407823

ABSTRACT:
During probe testing using a prober having probe needles formed by using a manufacturing technology for a semiconductor integrated circuit device, reliable contact is ensured between the probe needles and test pads. A pressing tool having at least one hole portion formed therein and extending therethrough between the main and back surface thereof is prepared. An elastomer in the form of a sheet and a polyimide sheet are successively disposed on the main surface of the pressing tool. With th elastomer and the polyimide sheet being electrostatically attracted to the pressing tool, the pressing tool is disposed on a thin-film sheet such that the main surface thereof faces the back surface (the surface opposite to the main surface thereof formed with the probe) of the thin-film sheet. Then, the thin-film sheet with the pressing tool bonded thereto is attached to a probe card.

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