Manufacturing method of semiconductor device

Details Manufacturing method of semiconductor device Manufacturing method of semiconductor device

2006-06-20

2006-06-20

Zarabian, Amir (Department: 2822)

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

Subsequent separation into plural bodies

C438S113000, C438S462000, C438S463000, C438S460000

Reexamination Certificate

active

07064046

ABSTRACT:
The invention provides an algorithm for aligning a rotating blade in a dicing process of partially dicing a wafer attached to a substrate. A width of a cut groove and distance between pads in the cut groove are detected by a recognition camera. Based on a result of this detection, alignment data Δy which is distance between a centerline of the width of the cut groove and a real centerline are calculated. Based on a difference between the distance of the pads in the cut groove and a target value of the distance, data Δz on alignment in a depth direction of the cut groove is calculated. The rotating blade is aligned by using the alignment data Δy and Δz.

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patent: WO 99/40624 (1999-08-01), None

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