Manufacturing method of semiconductor device

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – On insulating substrate or layer

Reexamination Certificate

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C438S030000, C438S096000, C438S680000, C257SE21170, C257SE21320, C257SE21051, C257SE21058, C257SE21077, C257SE21189, C257SE21229, C257SE21267, C257SE21400, C257SE21324, C257SE21411, C257SE21527

Reexamination Certificate

active

07833845

ABSTRACT:
An object is to provide a manufacturing method of a microcrystalline semiconductor film with favorable quality over a large-area substrate. After forming a gate insulating film over a gate electrode, in order to improve quality of a microcrystalline semiconductor film formed in an initial stage, glow discharge plasma is generated by supplying high-frequency powers with different frequencies, and a lower part of the film near an interface with the gate insulating film is formed under a first film formation condition, which is low in film formation rate but results in a good quality film. Thereafter, an upper part of the film is deposited under a second film formation condition with higher film formation rate, and further, a buffer layer is stacked on the microcrystalline semiconductor film.

REFERENCES:
patent: 4265991 (1981-05-01), Hirai et al.
patent: 4409134 (1983-10-01), Yamazaki
patent: 4605941 (1986-08-01), Ovshinsky et al.
patent: 5571571 (1996-11-01), Musaka et al.
patent: 5591987 (1997-01-01), Yamazaki et al.
patent: 6607790 (2003-08-01), Musaka
patent: 06-326026 (1994-11-01), None
patent: 07-254592 (1995-10-01), None

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