Manufacturing method of semiconductor device

Details Manufacturing method of semiconductor device Manufacturing method of semiconductor device

2007-03-06

2007-03-06

Dang, Phuc T. (Department: 2818)

Semiconductor device manufacturing: process

With measuring or testing

C257S668000

Reexamination Certificate

active

11064500

ABSTRACT:
In a method for manufacturing a semiconductor device by processing of a wafer level, in the case of forming the semiconductor device at the wafer level, on the basis of inspection results on individual semiconductor chips constituting a semiconductor wafer, a treatment for forming a circuit including a rewiring pattern is performed with respect to a semiconductor chip judged as a conforming product and a treatment in which a rewiring pattern is not formed in order to avoid having adverse influence on a semiconductor device of a conforming product or an inspection apparatus in an inspection of a formed semiconductor device after forming the semiconductor device is performed with respect to a semiconductor chip judged as a nonconforming product.

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patent: 6822317 (2004-11-01), Inoue et al.
patent: 6963136 (2005-11-01), Shinozaki et al.
patent: 8-330313 (1996-12-01), None
patent: 10-79362 (1998-03-01), None
patent: 2004-031463 (2004-01-01), None

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