4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Lead frame
  6. Small lead frame for connecting a large lead frame to a...

Shinko Electric Industries Co., Ltd

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Apparatus and process for mounting conductor balls on...

Metal fusion bonding – Process – Preplacing solid filler
Reexamination Certificate

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Apparatus for positioning a thin plate

Metal fusion bonding – With control means responsive to sensed condition – Work-responsive
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Capacitor, circuit board with built-in capacitor and method...

Electricity: electrical systems and devices – Electrostatic capacitors – Fixed capacitor
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Carrier substrate for producing semiconductor device

Semiconductor device manufacturing: process – Chemical etching – Combined with coating step
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Circuit pattern for multi-layer circuit board for mounting...

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
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Profile ID: LFUS-PAI-P-1917950

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