Manufacturing method of partial SOI wafer, semiconductor...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – On insulating substrate or layer

Reexamination Certificate

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Reexamination Certificate

active

07071039

ABSTRACT:
A semiconductor device includes a first semiconductor region having a buried oxide layer formed therein, a second semiconductor region in which the buried oxide layer does not exist, a trench formed to such a depth as to reach at least the buried oxide layer in a boundary portion between the first and second semiconductor regions, and an isolation insulating layer buried in the trench.

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Robert Hannon, et al. “0.25μm Merged Bulk DRAM and SOI Logic using patterned SOI,” 2000 Symposium on VLSI Technology Digest of Technical Papers pp. 66-67, 2000.
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