Manufacturing method of microelectromechanical system

Details Manufacturing method of microelectromechanical system Manufacturing method of microelectromechanical system

2011-01-25

2011-01-25

Ghyka, Alexander G (Department: 2812)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Physical stress responsive

C257SE29324

Reexamination Certificate

active

07875483

ABSTRACT:
To provide a method of easily forming a three-dimensional structure typified by a cantilever by using a thin film formed over an insulating surface, and provide a microelectromechanical system formed by such a method. A three-dimensional structure typified by a cantilever is formed by using a mask having a nonuniform thickness. Specifically, a microstructure is manufactured by processing a structural layer formed over a sacrificial layer by using a mask having a nonuniform thickness and then removing the sacrificial layer. The sacrificial layer can be formed by using a silicon layer or a metal layer.

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