Semiconductor device manufacturing: process – Having organic semiconductive component
Reexamination Certificate
2007-01-30
2007-01-30
Dang, Phuc T. (Department: 2818)
Semiconductor device manufacturing: process
Having organic semiconductive component
C438S128000, C349S073000
Reexamination Certificate
active
10733448
ABSTRACT:
It is an object of the present invention to provide a light emitting device having a structure wherein oxygen and moisture are prevented from reaching to the light emitting device, and to provide a manufacturing method thereof. It is another object of the present invention to seal a light emitting device in fewer steps without encapsulating a desiccant.The present invention provides a structure in which a pixel region13is surrounded by a first sealing material (having higher viscosity than a second sealing material)16including a spacer (filler, minute particles and/or the like) which maintains a gap between the two substrates, filled with a few drops of the transparent second sealing material17awhich is spread in the region; and sealed by using the first sealing material16and the second sealing material17.
REFERENCES:
patent: 4691995 (1987-09-01), Yamazaki et al.
patent: 5148301 (1992-09-01), Sawatsubashi et al.
patent: 5882761 (1999-03-01), Kawami et al.
patent: 6274887 (2001-08-01), Yamazaki et al.
patent: 6433358 (2002-08-01), Beierlein
patent: 6512271 (2003-01-01), Yamazaki et al.
patent: 6559594 (2003-05-01), Fukunaga et al.
patent: 6614076 (2003-09-01), Kawasaki et al.
patent: 2002/0033664 (2002-03-01), Kobayashi
patent: 2002/0039730 (2002-04-01), Morii
patent: 2002/0047555 (2002-04-01), Inukai
patent: 2004/0004434 (2004-01-01), Nishi et al.
patent: 2004/0121602 (2004-06-01), Maruyama et al.
patent: 04-212284 (1992-08-01), None
patent: 04-267097 (1992-09-01), None
patent: 06-176867 (1994-06-01), None
patent: 08-124677 (1996-05-01), None
patent: 2776040 (1998-05-01), None
patent: 2000-150145 (2000-05-01), None
patent: 2001-133795 (2001-05-01), None
patent: 2001-203076 (2001-07-01), None
patent: 2001-338771 (2001-12-01), None
patent: 2001-357973 (2001-12-01), None
Specification, Claims, Abstract and Drawings of U.S. Appl. No. 10,465,877, filed Jun. 20, 2003 entitled Light Emitting Device and Method of Manufacturing the Same.
Specification, claims, abstract of U.S. Appl. No. 09/707,862 filed Nov. 7, 2000 to Yamazaki et al.
Maruyama Junya
Ohno Yumiko
Takayama Toru
Dang Phuc T.
Robinson Eric J.
Robinson Intellectual Property Law Office P.C.
Semiconductor Energy Laboratory Co,. Ltd.
LandOfFree
Manufacturing method of light emitting device and... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Manufacturing method of light emitting device and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Manufacturing method of light emitting device and... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3796516