Etching a substrate: processes – Masking of a substrate using material resistant to an etchant
Reexamination Certificate
2006-07-04
2006-07-04
Ahmed, Shamim (Department: 1765)
Etching a substrate: processes
Masking of a substrate using material resistant to an etchant
C216S047000, C216S065000, C430S005000, C430S312000, C219S121610
Reexamination Certificate
active
07070701
ABSTRACT:
A fine structure manufacturing method is provided. The method comprises providing a lyophilic film on a treated surface of a substrate on which a pattern having a desired form is to be formed, providing a liquid-repellent film on an upper surface of the lyophilic film, the liquid-repellent film having liquid repellency relative to a liquid material used for forming the pattern, and eliminating a part of the liquid-repellent film located on an area where the pattern is to be formed.
REFERENCES:
patent: 5888679 (1999-03-01), Suzuki et al.
patent: 6042974 (2000-03-01), Iwata et al.
patent: 6638439 (2003-10-01), Shimomura
patent: 6783208 (2004-08-01), Kawase et al.
patent: 6936180 (2005-08-01), Kamijima
patent: 2003/0010241 (2003-01-01), Fujihira et al.
patent: 2003/0010408 (2003-01-01), Hosoe et al.
patent: 1366205 (2002-08-01), None
patent: 0 989 778 (2000-03-01), None
patent: 09-329706 (1997-12-01), None
patent: 10-123500 (1998-05-01), None
patent: 2001-130141 (2001-05-01), None
patent: 2001-281437 (2001-10-01), None
patent: 2001-284274 (2001-10-01), None
patent: 2001-284289 (2001-10-01), None
patent: 2002-221616 (2002-08-01), None
patent: 2002-221617 (2002-08-01), None
patent: 2002-225259 (2002-08-01), None
patent: 2002-250811 (2002-09-01), None
patent: 2002-273869 (2002-09-01), None
patent: 2003-270422 (2003-09-01), None
patent: WO99-48339 (1999-09-01), None
patent: WO 30/062920 (2003-07-01), None
Communication from Chinese Patent Office re: related application.
Communiction from Japan Patent Office re: counterpart application.
Communication from Taiwan Patent Office regarding counterpart application.
Saito Yuji
Sogo Tomohiko
Takagi Ken-ichi
Ahmed Shamim
Harness & Dickey & Pierce P.L.C.
Seiko Epson Corporation
LandOfFree
Manufacturing method of fine structure, optical element,... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Manufacturing method of fine structure, optical element,..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Manufacturing method of fine structure, optical element,... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3584963