Manufacturing method of electronic components embedded...

Details Manufacturing method of electronic components embedded... Manufacturing method of electronic components embedded...

2006-05-23

2006-05-23

Dang, Phuc T. (Department: 2818)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S109000

Reexamination Certificate

active

07049224

ABSTRACT:
A substrate including an electronic component is manufactured by preparing an electronic component having a terminal portion and a first insulative sheet, and mounting the electronic component to a surface of the first insulative sheet so that the terminal portion is opposed to the first insulative sheet. Then an opening portion is formed in the first insulative sheet so that a surface of the terminal portion is exposed and a conductive material is formed that is extended from the terminal portion to an upper portion of the first insulative sheet.

REFERENCES:
patent: 6389689 (2002-05-01), Heo
patent: 2005/0006142 (2005-01-01), Ishimaru et al.
patent: 2002-110714 (2002-04-01), None
patent: 2002-290006 (2002-10-01), None

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