Semiconductor device manufacturing: process – Formation of semiconductive active region on any substrate – Fluid growth from liquid combined with subsequent diverse...
Reexamination Certificate
2006-05-02
2006-05-02
Trinh, Michael (Department: 2822)
Semiconductor device manufacturing: process
Formation of semiconductive active region on any substrate
Fluid growth from liquid combined with subsequent diverse...
C438S478000, C438S584000, C438S674000
Reexamination Certificate
active
07037812
ABSTRACT:
A manufacturing method of a circuit substrate, in which an electronic circuit is formed on a surface of a base member by a solution jetting device. The manufacturing method comprises: jetting liquid drops of a solution which is supplied into a nozzle having a discharge port with an inner diameter of 0.1 μm to 100 μm and includes a plurality of fine particles to form an electronic circuit by melting and sticking to one another and a dispersant for dispersing the fine particles, from the discharge port toward the surface of the base member by applying a voltage of an arbitrary waveform to the solution to charge the solution; and exposing the jetted liquid drops received on the surface of the base member to light or heat to make the fine particles melt and stick to one another.
REFERENCES:
patent: 6503831 (2003-01-01), Speakman
patent: 2002/0050061 (2002-05-01), Komyoji et al.
patent: 09-320363 (1997-12-01), None
patent: 11-274671 (1999-10-01), None
Kawahara Yuusuke
Murata Kazuhiro
Yokoyama Hiroshi
Yoshida Tetsuya
Cohen & Pontani, Lieberman & Pavane
Konica Minolta Holdings Inc.
National Institute of Advanced Industrial Science and Technology
Trinh Michael
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