Manufacturing method of an acceleration sensing device

Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Physical stress responsive

Reexamination Certificate

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Reexamination Certificate

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07459330

ABSTRACT:
An acceleration sensing device includes a movable sensing member, a frame member and a supporting member. The supporting member is coupled between the movable sensing member and the frame member so as to support the movable sensing member. The acceleration sensing device further includes a covering member disposed above the movable sensing member, with a gap between the covering member and the movable sensing member. The acceleration sensing device still further includes internal electrodes, interconnection films, external electrodes and a resin film. The internal electrodes are arranged around the covering member. The interconnection films are disposed on the frame member so as to be coupled to the internal electrodes. The external electrodes are disposed on the interconnection films. The resin film is disposed on the frame member so as to seal the covering member. Also, there is provided a manufacturing method of the acceleration sensing device.

REFERENCES:
patent: 4891984 (1990-01-01), Fujii et al.
patent: 6263735 (2001-07-01), Nakatani et al.
patent: 6316840 (2001-11-01), Otani
patent: 6925875 (2005-08-01), Silverbrook
patent: 7334476 (2008-02-01), Ichikawa
patent: 11135804 (1999-05-01), None

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