Fishing – trapping – and vermin destroying
Patent
1993-10-25
1994-10-18
Thomas, Tom
Fishing, trapping, and vermin destroying
437227, 437182, 437183, H01L 21302
Patent
active
053568389
ABSTRACT:
A method of manufacturing and a structure of a semiconductor device has an I/O terminal whereby when individual semiconductor chips are separated from the semiconductor wafer manufactured according to this invention, the terminals are exposed on the edges of the semiconductor chip allowing for the interconnection of the terminals when the semiconductor chips are stacked. The bump electrode is formed using metal masks and magnets by mounting a solder ball on an aperture of a first mask to form the solder bump on an electrode pad provided on a semiconductor wafer. A conductive material forms a conductive pattern between the solder bumps of the individual semiconductor chips using an aperture of a second mask. The individual semiconductor chips which are separated from the semiconductor wafer are then easily stacked and packaged by use of the I/O terminals on the sides of the individual semiconductor chips.
REFERENCES:
patent: 4930216 (1990-06-01), Nelson
patent: 4984358 (1991-01-01), Nelson
patent: 5094970 (1992-03-01), Yoshida et al.
patent: 5126286 (1992-06-01), Chance
patent: 5136354 (1992-08-01), Morita et al.
patent: 5157588 (1992-10-01), Kim et al.
patent: 5186381 (1993-02-01), Kim
patent: 5199164 (1993-04-01), Kim et al.
patent: 5223454 (1993-06-01), Uda et al.
Picardat Kevin M.
Samsung Electronics Co,. Ltd.
Thomas Tom
LandOfFree
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