Manufacturing method of a microelectromechanical switch

Details Manufacturing method of a microelectromechanical switch Manufacturing method of a microelectromechanical switch

2007-07-10

2007-07-10

Smith, Bradley (Department: 2891)

Active solid-state devices (e.g., transistors, solid-state diode

Responsive to non-electrical signal

Physical deformation

C257SE29324

Reexamination Certificate

active

11343400

ABSTRACT:
The method for manufacturing a micromechanical switch includes manufacturing a hanging bar, on a first semiconductor substrate, equipped at an end thereof with a contact electrode, and a frame projecting from the first semiconductor substrate. A second semiconductor substrate with conductive tracks includes a second input/output electrode and a third starting electrode, and first and second spacers electrically connected to the conductive tracks. The frame is abutted with the first spacers so that the fourth contact electrode abuts on the second input/output electrode in response to an electrical signal provided to the hanging bar by the third starting electrode.

REFERENCES:
patent: 5638946 (1997-06-01), Zavracky
patent: 6872902 (2005-03-01), Cohn et al.
patent: 6903637 (2005-06-01), Miyazaki et al.

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