Manufacturing method of a micro structure

Details Manufacturing method of a micro structure Manufacturing method of a micro structure

2005-05-10

2005-05-10

Chaudhari, Chandra (Department: 2813)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Physical stress responsive

C438S458000

Reexamination Certificate

active

06890788

ABSTRACT:
A release layer is formed on a substrate, and plural thin-film patterns are formed on the release layer. The release layer is etched back at a prescribed depth at least in regions close to the circumferences of the thin-film patterns. The thin-film patterns are transferred sequentially to a counter substrate to be laminated on the counter substrate and to thereby form a micro structure. This manufacturing method is employed in a case that the combination of thin-film patterns and are lease layer is such that when a prescribed pressure is applied to each of the thin-film patterns on the release layer in the transferring, the height of a raised portion of the release layer that would be appeared in a region close to the circumference of the thin-film pattern if the release layer were not be etched back is greater than or equal to the thickness of the thin-film pattern.

REFERENCES:
patent: 6506620 (2003-01-01), Scharf et al.
patent: 6790699 (2004-09-01), Vossenberg et al.
patent: 20020197761 (2002-12-01), Patel et al.
patent: 20030054588 (2003-03-01), Patel et al.
patent: A 11-28768 (1999-02-01), None
patent: A 2000-238000 (2000-09-01), None

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