Manufacturing method, including etch-rate monitoring

Details Manufacturing method, including etch-rate monitoring Manufacturing method, including etch-rate monitoring

1991-12-31

1993-11-09

Dang, Thi

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156655, 156656, 156666, B05D 500

Patent

active

052599205

ABSTRACT:
A method is described for monitoring the rate at which metal layers are chemically etched. The method involves an indicator layer of metal formed on a surface of a monitor substrate. The thickness of the indicator layer varies according to a wedge-shaped profile along a longitudinal axis. The indicator layer is exposed to an etchant medium for a predetermined duration. During such exposure, a portion of the indicator layer is completely removed, exposing the underlying surface and creating an edge between the exposed surface and the remaining portion of the indicator layer. The etching rate is determined by reference to the longitudinal location of the edge.

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Gust, W. et al., "Techniques for the Production of Oriented Bicrystals and Results on Specimens Prepared by These Methods," Acta Metallurgica, vol. 28, Pergamon Press Ltd., 1980, pp. 1235-1243.

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