Manufacturing method for semiconductor device embedded...

Details Manufacturing method for semiconductor device embedded... Manufacturing method for semiconductor device embedded...

2011-07-19

2011-07-19

Lee, Cheung (Department: 2812)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S026000, C438S063000, C438S125000, C257SE21499, C257SE21505, C257SE21511

Reexamination Certificate

active

07981724

ABSTRACT:
A manufacturing method for a semiconductor device embedded substrate, includes: a first step of preparing a semiconductor device having a first insulating layer; a second step of arranging the semiconductor device on one surface of a support body; a third step of forming a second insulating layer on the one surface of the support body; a fourth step of removing the support body; a fifth step of forming a third insulating layer on a surface of each of the semiconductor device and the second insulating layer; a sixth step of mounting a wiring substrate on a surface of each of the semiconductor device and the second insulating layer; a seventh step of forming a via-hole in the second insulating layer and the third insulating layer; and an eighth step of forming a second wiring pattern on a surface of each of the first insulating layer and the second insulating layer.

REFERENCES:
patent: 2006/0202353 (2006-09-01), Wakabayashi et al.
patent: 2842378 (1998-10-01), None
patent: 2005-332887 (2005-12-01), None
patent: 4121542 (2008-05-01), None

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