Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive...
Patent
1987-08-07
1989-03-07
Dees, Jose G.
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
430311, 430314, 430394, 269 37, 269254R, 269903, 269115, 269307, G03C 500
Patent
active
048106160
ABSTRACT:
Manufacturing method for integrated circuit chip carrier or similar devices comprises the steps of producing the substrate as a discrete part by pressing ceramic powder in a precision mold and sintering the pressed part. The discrete substrates are then placed in a work holder in which a plurality of substrates are precisely located with both surfaces of each substrate exposed. The manufacturing steps of metallizing the substrates, imaging, plating, resist removal, etching, and so on, can then be carried out on all of the substrates in the work holder simultaneously. The processes can be applied to both surfaces of each substrate simultaneously and in addition, further steps such as assembly of an IC chip to each substrate and wire bonding can be carried out while the substrates are in the work holder. The process greatly reduces the cost of manufacturing chip carriers, particularly the type having terminal pads on both surfaces of the substrate and conductors extending between the major surfaces.
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Grabbe Dimitry G.
Korsunsky Iosif
AMP Incorporated
Dees Jos,e G.
Trygg James M.
Wolstoncroft Bruce J.
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