Etching a substrate: processes – Etching of semiconductor material to produce an article...
Reexamination Certificate
2007-02-27
2010-11-02
Alanko, Anita K (Department: 1713)
Etching a substrate: processes
Etching of semiconductor material to produce an article...
C216S027000, C219S121690
Reexamination Certificate
active
07824560
ABSTRACT:
A manufacturing method for a substrate for an ink jet head, including formation of an ink supply port in a silicon substrate, the method includes a step of forming, on one side of the substrate, an etching mask layer having an opening at a position corresponding ink supply port; a step of forming unpenetrated holes through the opening of the etching mask layer in at least two rows in a longitudinal direction of the opening; and a step of forming the ink supply port by crystal anisotropic etching of the substrate in the opening.
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Koyama Shuji
Ono Kenji
Sakai Toshiyasu
Yamamuro Jun
Alanko Anita K
Canon Kabushiki Kaisha
Fitzpatrick ,Cella, Harper & Scinto
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