Manufacturing method for electronic component module and...

Details Manufacturing method for electronic component module and... Manufacturing method for electronic component module and...

2007-10-02

2007-10-02

Le, Thao P. (Department: 2818)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S103000, C438S108000, C438S613000, C257S777000, C257SE21021

Reexamination Certificate

active

10724202

ABSTRACT:
A semiconductor bear chip having a bump subjected to high temperatures is pressed, from the upper side, onto a wiring board including a wiring pattern, a thermosetting resin film covering an electrode area on the wiring pattern and having insulating particles dispersed and included and a thermoplastic resin film covering the thermosetting resin film, while applying a ultrasonic wave, thereby inserting the bumps of the semiconductor bear chip through the thermoplastic resin film and the thermosetting resin film to bond the top end portion of the bump with the electrode area.

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Kisker-Biotech: “Microparticles”, Dec. 25, 2001, XP002418558, 9 pages.

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