Manufacturing method for double-sided wiring board

Details Manufacturing method for double-sided wiring board Manufacturing method for double-sided wiring board

1995-02-10

1997-01-21

Caldarola, Glenn A.

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Making electrical device

216 17, 216 18, 216 20, 430313, 430317, 430318, 430319, G03C 500

Patent

active

055958583

ABSTRACT:
A photosensitive insulation bonding layer is formed on a conducting layer. The photosensitive insulation bonding layer is subjected to exposure treatment to produce an exposed area and an unexposed area. Another conducting layer is formed on the outer surface of the photosensitive insulation bonding layer which has undergone the exposure treatment, then both conducting layers are photoetched to produce desired wiring patterns. In the next step, the unexposed area is removed from the photosensitive insulation bonding layer by development so as to form an access opening for connecting a circuit component to the wiring patterns. Then, the exposed area of the photosensitive insulation bonding layer is turned into an insulating layer by curing.

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patent: 4642160 (1987-02-01), Burgess
patent: 4769309 (1988-09-01), King et al.
patent: 4888450 (1989-12-01), Lando et al.
patent: 5302492 (1994-04-01), Ott et al.
patent: 5334487 (1994-08-01), Kindl et al.
patent: 5352325 (1994-10-01), Kato

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