Manufacturing method for devices

Details Manufacturing method for devices Manufacturing method for devices

2008-02-27

2010-11-02

Zarneke, David A (Department: 2891)

Semiconductor device manufacturing: process

Semiconductor substrate dicing

By electromagnetic irradiation

C438S113000, C438S464000, C257SE21599

Reexamination Certificate

active

07825009

ABSTRACT:
A manufacturing method for devices including a wafer supporting step of mounting an adhesive film to the lower surface of a wafer and attaching the wafer through the adhesive film to the upper surface of a dicing tape mounted on an annular frame, a laser processing step of applying a pulsed laser beam having an absorption wavelength to the wafer along separation lines formed on the upper surface of the wafer after mounting the adhesive film to the dicing tape, thereby separating the wafer into the individual devices and cutting the adhesive film, and a pickup step of expanding the dicing tape after performing the laser processing step to thereby increase the spacing between any adjacent ones of the individual devices, and peeling off to pick up each of the individual devices from the dicing tape in the condition where the adhesive film is mounted on the lower surface of each device.

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