Manufacturing method for compound semiconductor device and...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having schottky gate

Reexamination Certificate

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C438S172000, C257SE21403

Reexamination Certificate

active

07985637

ABSTRACT:
After an n-type AlGaN barrier layer (3) is formed over a substrate (1), an n-type GaN contact layer (4) is formed over the n-type AlGaN barrier layer (3). Next, the n-type GaN contact layer (4) is wet-etched with using an etching solution containing an organic alkali agent and an oxidizer while the n-type GaN contact layer (4) is irradiated with an ultraviolet illumination.

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International Search Report of PCT/JP2006/304795, date of mailing May 30, 2006.
J. A. Bardwell et al.; “Ultraviolet photoenhanced wet etching of GaN in K2S2O8 Solution”, Journal of Applied Physics, vol. 89, No. 7, Apr. 1, 2001, pp. 4142-4149. Cited in the ISR.
Z. H. Hwang et. al.: “Electrodeless wet etching of GaN assisted with chopped ultraviolet light” Applied Physics Letters, vol. 84, No. 19, May 10, 2004.
C. Youtsey et. al., “Smooth n-type GaN surfaces by photoenhanced wet etching” Applied Physics Letters, vol. 72, No. 5, Feb. 2, 1998.
C. Youtsey et. al., “Highly anisotropic photoenhanced wet etching of n-type GaN” Applied Physics Letters, vol. 71, No. 15, Oct. 13, 1997.
Notification of Transmittal of Translation of the International Preliminary Report on Patentability (Form PCT/IB/338) of International Application No. PCT/JP2006/304795 mailed Sep. 25, 2008 with Forms PCT/IB/373 and PCT/ISA/237.

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