Manufacturing method for circuit board

Details Manufacturing method for circuit board Manufacturing method for circuit board

1979-06-27

1981-10-06

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

29841, 29846, 1566591, 1566611, 156902, 174 685, 427 97, C23F 102

Patent

active

042933773

ABSTRACT:
An electrical circuit board is prepared by application, over a conductive foil which is supported on a substrate, of a hot-melt resin in accordance with the desired circuit pattern. The resin may be applied by screen printing and, after curing, will function as a resist coating for the conductive material during subsequent chemical removal of the foil from unprotected areas to form the individual conductors of the pattern. During subsequent connection of the circuit to other components contact areas on the individual conductors may be exposed by contacting the resin coating with molten solder.

REFERENCES:
patent: 2673142 (1954-03-01), Glynn
patent: 3881884 (1975-05-01), Cook et al.
patent: 4127436 (1978-11-01), Friel
patent: 4172757 (1979-10-01), Thornburg

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