Etching a substrate: processes – Nongaseous phase etching of substrate – With measuring – testing – or inspecting
Reexamination Certificate
2006-05-30
2006-05-30
Ahmed, Shamim (Department: 1765)
Etching a substrate: processes
Nongaseous phase etching of substrate
With measuring, testing, or inspecting
C216S013000, C216S017000, C216S018000, C438S014000
Reexamination Certificate
active
07052624
ABSTRACT:
The present invention provides a manufacturing method for an electronic device that enables high-yield manufacturing of electronic devices, by detecting potential short circuits between a contact plug and a conductive part contacting the periphery of the contact plug, directly after forming the contact plug; and the electronic device. The manufacturing method includes a hole-forming step of forming a contact hole in an insulating film that covers a conductive part formed on a first main surface of a substrate and an area surrounding the conductive part, the hole being formed beside the conductive part, and the conductive part including a first material; a material-supplying step of supplying a second material to the contact hole, the second material having a reactive property with the first material; and an inspection step, after the second material has been supplied, of inspecting for evidence of a reaction by the conductive part with the second material.
REFERENCES:
patent: 6204075 (2001-03-01), Kikuchi
patent: 6555922 (2003-04-01), Nakagawa
patent: 6620637 (2003-09-01), Noda
Jiwari Nobuhiro
Matsutani Tetsuya
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