Manufacturing method for a semiconductor device

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – On insulating substrate or layer

Reexamination Certificate

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C438S154000, C438S199000, C438S216000, C438S230000, C438S286000, C438S287000

Reexamination Certificate

active

06864128

ABSTRACT:
A gate insulating film4, two polysilicon films5and7, and a silicon nitride film9are successively laminated on a semiconductor substrate1in this order. Each of the polysilicon films5and7contains phosphorus. The polysilicon film5has a region having a phosphorus concentration higher than that of the polysilicon film7. Gate electrodes10n, 10p, 40n, and40pare formed on the gate insulating film4by partly etching the polysilicon films5and7and the silicon nitride film9. In this case, the etching rate of the region of the polysilicon film5, having a phosphorus concentration higher than that of the polysilicon film7, is higher than that of the polysilicon film7. Due to this difference, notches are formed at the bottom portions on side surfaces of respective gate electrodes10p, 40n, and40p.

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T. Ghani, et al., IEDM Technical Digest, pp. 415-418, “100 NM Gate Length High Performance/Low Power CMOS Transistor Structure”, 1999.
T. Matsumoto, et al., IEDM Technical Digest, pp. 219-222. “70 NM SOI-CMOS of 135 GHzƒmaxWith Dual Offset-Implanted Source-Drain Extension Structure for RF/Analog and Logic Applications”, 2001.
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