Manufacturing method for a semi-conductor on insulator...

Semiconductor device manufacturing: process – Formation of semiconductive active region on any substrate – Fluid growth from gaseous state combined with subsequent...

Reexamination Certificate

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C257SE21561

Reexamination Certificate

active

07989327

ABSTRACT:
A method of manufacturing a semi-conductor on insulator substrate from an SOI substrate, wherein a Si1-xGexlayer is formed on a superficial layer of silicon having a buried electrical insulating layer. A silicon oxide layer is formed on the Si1-xGexlayer. The resulting stack of silicon, Si1-xGexand silicon oxide layers is etched up to the buried insulating layer leaving an island of the stack, or up to the superficial layer leaving a zone of silicon and an island of the stack. A mask is formed to protect against oxidation on the etched structure, wherein the protective mask only leaves visible the silicon oxide layer of the island. The germanium of the Si1-xGexlayer is condensed on the island to obtain an island comprising a layer that is enriched in germanium, or even a layer of germanium, on the insulating layer, with a silicon oxide layer on top of it.

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Tezuka et al., “Dislocation-free formation of relaxed SiGe-on-insulator layers”, Applied Physics Letters, vol. 80, No. May 13, 2002.
Tezuka et al., “A Novel Fabrication Technique of Ultrathin and Relaxed SiGe Buffer Layers with High Ge Fraction for Sub-100nm Strained Silicon-on-Insulator MOSFETs”, Jpn J. Appin. Phys. vol. 40 (2001) pp. 2866-2874.
French Search Report, (Aug. 2008).

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