Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates
Reexamination Certificate
2011-05-24
2011-05-24
Smith, Matthew S (Department: 2823)
Semiconductor device manufacturing: process
Bonding of plural semiconductor substrates
C257SE21001, C257SE21599
Reexamination Certificate
active
07947570
ABSTRACT:
It is an object to provide a homogeneous semiconductor substrate in which defective bonding is reduced. Such a semiconductor substrate can be formed by the steps of: disposing a first substrate in a substrate bonding chamber which includes a substrate supporting base where a plurality of openings is provided, substrate supporting mechanisms provided in the plurality of openings, and raising and lowering mechanisms which raise and lower the substrate supporting mechanisms; disposing a second substrate over the first substrate so as not to be in contact with the first substrate; and bonding the first substrate to the second substrate by using the raising and lowering mechanisms to raise the substrate supporting mechanisms.
REFERENCES:
patent: 6534380 (2003-03-01), Yamauchi et al.
patent: 2003/0181124 (2003-09-01), Lee et al.
patent: 2007/0160507 (2007-07-01), Satoh et al.
patent: 2007/0249098 (2007-10-01), Cady et al.
patent: 2008/0135127 (2008-06-01), Hwang et al.
patent: 04085839 (1992-03-01), None
patent: 05-275300 (1993-10-01), None
patent: 08-069952 (1996-03-01), None
patent: 11-097379 (1999-04-01), None
patent: 2005082443 (2005-03-01), None
patent: 2007-189222 (2007-07-01), None
Moriwaka Tomoaki
Ohnuma Hideto
Omata Takatsugu
Fan Michele
Robinson Eric J.
Robinson Intellectual Property Law Office P.C.
Semiconductor Energy Laboratory Co,. Ltd.
Smith Matthew S
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